BASF and Hisense have jointly presented a new highly energy efficient domestic refrigeration technology using the newly launched Elastocool® low-density polyurethane solution from BASF. Combined with Hisense’s advanced foaming technology, Elastocool® significantly reduces polyurethane material usage while improving thermal insulation performance. This new generation of refrigerators enables consumers to reduce the energy consumption and carbon dioxide emission.
Dr. Jeffrey Lou, Vice President, Business Management of Polyurethanes, BASF Greater China said “In recent years, growing awareness has led customers to choose high performance, energy efficient appliances to conserve resources and protect the environment. BASF is committed to supporting the leading refrigerator manufacturers such as Hisense to provide innovative polyurethane solutions to optimize the production process by shortening de-molding time, reducing material usage whilst enhancing insulation performance to meet customer requirements.”
“Hisense and BASF share the vision of contributing to sustainable development for the future,” says Gan Yonghe, Vice President, Hisense Kelon Electronics Holdings Co. Ltd. “We are looking forward to strengthening the cooperation with BASF for the development of next generation refrigeration technologies.”
Using BASF’s Elastocool® low density PU system, the foam density can be reduced to 30kg/m3 which saves raw materials cost up to 8%. After a series of stringent tests, the energy consumption of the refrigerator has a proven reduction of 3-5% benefiting from the low thermal conductivity (K value).
In addition, the outstanding dimensional stability and compressive strength of the system allows manufacturers to design energy-saving refrigerators that combine excellent insulation performance with minimal material thickness, providing more storage space inside the fridge.
“Through this cooperation with BASF, we have become a pioneer in developing this 245fa/c-pentane co-blown PU technology. This success is attributed to our combined experience, technology and industry knowledge, bringing refrigeration technology to a new era,” said Hu Feng, Engineer, Hisense R&D Center.
BASF and Hisense have worked closely on the development, production and commercialization of this Elastocool® low density PU system. The initial technology was developed in April 2012. After a series of precisely defined testing including mechanical properties, system performance, material reactivity and good processing capabilities, this new Elastocool® technology has been successfully adopted by Hisense for its brand series “Ronshen” refrigerators and freezers, which is named as one of the “Top 10 Quality Refrigerator Brands in China”.
